Stress Intensity of Delamination in a Sintered-Silver Interconnection
نویسندگان
چکیده
منابع مشابه
Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint
In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between material...
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Thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. Thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in material...
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Citing this paper Please note that where the full-text provided on King's Research Portal is the Author Accepted Manuscript or Post-Print version this may differ from the final Published version. If citing, it is advised that you check and use the publisher's definitive version for pagination, volume/issue, and date of publication details. And where the final published version is provided on th...
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The silver toughened alumina ceramics, which were fabricated via a conventional ceramic processing route using commercially available alumina and silver oxide powders as the starting materials, exhibit a higher fracture toughness (6 to 9 MPamo.5) than the monolithic alumina ceramic ( 2.5 to 3.0 MPamo.5). The weak interfacial bonding between the silver inclusions and the alumina matrix is charac...
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ژورنال
عنوان ژورنال: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
سال: 2014
ISSN: 2380-4491
DOI: 10.4071/hitec-wa26